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PCB Cleaning for High-Reliability Electronics

Remove flux residue, dust and ionic contamination without introducing lint or static damage.

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What are we trying to achieve?

Produce contamination-free PCBs ready for inspection, conformal coating, or final assembly.

Micro-shorts, latent ESD damage, and conformal coating delamination caused by improper wiping materials or techniques.

Types of Contamination

Flux residue Fine dust Solder balls Fingerprints Static discharge Loose fibres

Critical Requirements

Low Ionic Residue

Prevents micro shorts and dendrite growth.

ESD Safe

Protects sensitive ICs during the physical wipe.

Solvent Resistant

Will not dissolve or leach binders when soaked in IPA or flux removers.

Standard Cleaning Procedure

STEP 1

Apply Solvent

Saturate the wipe with IPA or approved flux remover. Do not spray the board directly.

STEP 2

Single Direction Wipe

Wipe in one continuous direction to lift and pull flux away from components. Do not scrub.

STEP 3

Inspect

Examine under magnification/UV to ensure flux is fully removed.

STEP 4

Dispose

Discard the wipe after a single pass to prevent cross-contamination.

Best Practices

  • Wear ESD-safe gloves
  • Store wipes in sealed bags
  • Clean in one direction
  • Use pre-saturated wipes for consistency

Avoid These Mistakes

  • Circular wiping (moves dirt around)
  • Reusing dirty wipes
  • Using cotton (leaves lint)
  • Touching cleaned surface bare-handed

Related Resources

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Need Custom Manufacturing?

Custom GSM Cleanroom Packaging OEM Branding

We engineer wipes to fit your exact standard operating procedure.

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Frequently Asked Questions

No. Reusing wipes for PCB cleaning risks dragging ionic contamination back across the board.

Compressed air pushes dust into crevices and can generate static charges. Wiping physically removes the contamination.

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